PCBA

Zhiyi Electronics - Comprehensive Testing for PCBA, SMT, and DIP Products

Zhiyi Electronics provides comprehensive testing for all our PCBA, SMT, and DIP products.

Our testing capabilities for SMT assemblies include automated optical inspection (AOI) and X - ray inspection. AOI systems can quickly detect defects such as missing components, wrong components, and solder joint defects. X - ray inspection is used to inspect hidden solder joints, such as those in BGA packages.

For PCBA products, we offer a wide range of tests, including in - circuit testing (ICT), functional testing (FCT), and boundary scan testing. ICT checks the electrical connectivity of components on the PCB, while FCT verifies that the PCBA functions according to its design specifications.

In DIP, we perform visual inspection and functional testing. Our visual inspection ensures that all components are correctly inserted and soldered, while functional testing checks that the DIP assembly works as intended.

We also offer environmental testing, such as temperature and humidity testing, to ensure that our PCBA, SMT, and DIP products can withstand harsh operating conditions.